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  ccd area image sensor 1 publication date: may 2003 smd00008cec MN39116AT diagonal 4.5 mm (type-1/4) 270k-pixel ccd area image sensor overview the MN39116AT is a 4.5 mm (type-1/4) interline transfer ccd (it-ccd) solid state image sensor device. this device uses photodiodes in the optoelectric con- version section and ccds for signal readout. the elec- tronic shutter function has made an exposure time of 1/10 000 seconds possible. further, this device has the features of high sensitivity, low noise, broad dynamic range, and low smear. this device has a total of 267 206 pixels (542 horizon- tal 493 vertical) and provides stable and clear images with a resolution of 360 horizontal tv-lines and 350 ver- tical tv-lines. part number size system color or b/w MN39116AT 4.5 mm ( type-1/4) eia b/w features ? effective pixel number 512 (horizontal) 491 (vertical) ? high sensitivity ? broad dynamic range ? low smear ? electronic shutter applications ? surveillance cameras ? fa, oa cameras (top view) 1 2 3 4 5 6 7 14 13 12 11 10 9 8 v dd r rd vo lg h2 h1 pw v3 v2 v1 pt sub v4 pin assignments
MN39116AT 2 smd00008cec block diagram photo diode 4 14 1 3 13 v4 v3 v2 v1 r h2 h1 sub 12 11 10 8 pt 9 7 6 2 sub vo v dd gnd 14 5 gnd lg (2 dummies + ob1 + valid area 491 + ob1 + 1 dummy) (2 columns ob + 512 columns valid area + 28 columns ob) horizontal shift register (top 6 dummies) (internal connection) output section vertical shift register pin descriptions pin no. symbol description 8 sub substrate 9 pt p-well for protection circuit 10 v1 vertical shift register clock pulse 1 11 v2 vertical shift register clock pulse 2 12 v3 vertical shift register clock pulse 3 13 v4 vertical shift register clock pulse 4 14 pw p-well pin no. symbol description 1v dd power supply 2 r reset pulse (rg) 3 rd reset drain 4 vo video output 5 lg output load transistor gate 6 h2 horizontal register clock pulse 2 7 h1 horizontal register clock pulse 1 device parameter (h v) parameter v alue unit pixel number * 512 491 pixel image sensing block dimension 3.614 4 2.716 mm 2 pixel dimension 7.2 5.6 m 2 note) * : ob columns are not included.
MN39116AT 3 smd00008cec parameter absolute maximum rating operating condition unit lower limit upper limit min typ max v dd ? 0.2 18.0 14.5 15.0 15.5 v v rd ? 0.2 18.0 14.5 15.0 15.5 v v pt * 3, 4 ? 10.0 0.2 ? 8.3 ? 8.0 ? 7.7 v gnd (referene voltage) ? 0 ? v v lg * 6 (supplied internally) v v og (supplied internally) v v r high-low ? 8.0 3.0 3.3 5.3 v bias (supplied internally) v v h1 high ? 8.0 3.0 3.3 5.3 v low ? 0.2 ?? 0.05 0 0.05 v v h2 high ? 8.0 3.0 3.3 5.3 v low ? 0.2 ?? 0.05 0 0.05 v v sub * 2 (supplied internally) v v sub * 1 ? 0.2 45.0 22.5 23.0 23.5 v v v1 * 3, 4, 5 high ? 18.0 14.5 15.0 15.5 v middle ??? 0.2 0 0.2 v low ? 9.0 ?? 8.3 ? 8.0 ? 7.7 v v v2 * 3, 4, 5 middle ? 15.0 ? 0.2 0 0.2 v low ? 9.0 ?? 8.3 ? 8.0 ? 7.7 v v v3 * 3, 4, 5 high ? 18.0 14.5 15.0 15.5 v middle ??? 0.2 0 0.2 v low ? 9.0 ?? 8.3 ? 8.0 ? 7.7 v v v4 * 3, 4, 5 middle ? 15.0 ? 0.2 0 0.2 v low ? 9.0 ?? 8.3 ? 8.0 ? 7.7 v operating temperature ? 10 60 ? 25 ? c storage temperature ? 30 80 ??? c absolute maximum ratings and operating conditions note) 1. standard photo detecting condition standard photo detecting condition stands for detecting image with a light source of color temperature of 2 856k, lumi- nance of 1 050 cd/m 2 , and using a color temperature conversion filter lb-40 (hoya), infrared cut filter caw-500s with thickness 2.5 mm for a light path and with f8 lens aperture. the quantity of the incidental light to a photo-detecting surface under the above condition is defined as the standard quantity of light. 2. * 1: v sub when using electronic shutter function v sub (v) v sub h v sub l gnd v sub (v) (supplied internally)
MN39116AT 4 smd00008cec absolute maximum ratings and operating conditions (continued) note) 2. * 2: v sub supplied internally is the voltage suppressing the blooming generation at 1 000 light quantity relative to the standard light quantity. * 3: relation between v pt and v vl set v pt under the following condition against vl of a vertical transfer clock waveform. v pt vl (v v1l to v v4l ) * 4: absolute maximum ratings ? 0.2 < v sub ? v pt < 55 (v) ? 0.2 < v v ? v pt < 24.5 (v) * 5: ground lg pin with the capacitor of 0.047 f or more. ground r pin with the capacitor of 1 m ? . optical characteristics 1.2 1 0.8 0.6 0.4 .02 0 400 500 600 wavelength (nm) 700 800 relative sensitivity parameter symbol conditions min typ max unit s/n ratio (dark) s/nd dark condition 58 60 ? db sensitivity so j chart f8 480 650 ? mv saturation output sc saturation maximum output 700 900 ? mv vertical smear sm 1/10 v chart, f2.8 ?? 0.01 % graph of characteristics ccd spectral characteristics
MN39116AT 5 smd00008cec timing diagram ? high speed pulse timing 50% 50% 50% 50% 50% h2 ccd output r clamp pulse (ds1) sampling pulse (ds2) 21 ns 3 ns ? 2 ns 10 ns 52 ns 3 ns 50% 50% 26 ns 3 ns 8 ns 5 ns 8 ns 5 ns 50% 50% 26 ns 3 ns
MN39116AT 6 smd00008cec timing diagram (continued) ? rise time and fall time of each pulse 0.9 0.9 0.1 0.1 0.9 v1 , v3 0.1 0.9 300 ns 300 ns 300 ns 300 ns 0.1 0.9 v2 , v4 0.1 0.9 300 ns 300 ns 0.1 0.9 h1 , h2 , r 0.1 0.9 10 ns 10 ns 0.1 0.9 ds1, ds2 0.1 0.9 10 ns 10 ns 0.1
MN39116AT 7 smd00008cec package dimensions (unit: mm) ? wdip014-p-0400f 0.015 10.160.25 10.000.08 9.000.10 5.000.08 0.250.05 3.400.15 1.300.10 (1.30) (0.80) 10.000.08 9.000.10 5.000.08 8 14 7 (1.19) (0.60) 0.300.05 1 7 1 8 valid pixel center 14 1.27 0.3 m 3.500.20 (2.50) 2-r0.40 (depth 0.30) reference plane 1. the center of the package is equal to the center of the effective pixel area. 2. the rotation angle of the effective pixel area: up to 1.0 degree 3. the distance from the bottom face of the package to the surface of the effective pixel area: 1.69 mm 0.10 mm 4. the tilt of the effective pixel area for the bottom face of the package: up to 25 m 5. thickness of seal glass is 0.8 mm, and the refractive index is 1.50. 6. package weight: 0.65 g (typ.)
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteris- tics and applied circuits examples of the products. it neither warrants non-infringement of intellec- tual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) the products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instru- ments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage, and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2002 jul


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